Principal Engineer Process Development (m / w)

We are looking for a technical lead for production as well as process development of the new generation of devices, with the focus on wet etching (Spray Batch Tools, Spin Wet Etching) and thin wafers (Wafer Thinning, Taiko Grinding). You are capable to establish new processes, solve complex problems in the production environment and provide new ideas by questioning of the existing solutions for both Si and SiC technologies. You are able to establish successful internal and external collaborations and work persistently to achieve common targets. In close collaboration with R&D device development and process integration, you develop and execute the technology roadmap and continuous improvement projects.

Your responsibilities:

• Taking the process ownership for Wet Chemical Etching and other related processes and tools. Supporting and sustaining of high-volume semiconductor production
• Establishing and optimization of single- and batch wet etch semiconductor processes, wafer thinning (including Taiko grinding) within BiMOS production (Wet Etch / Thinning area tools and related metrology) to gain better devices, yield and productivity
• Full involvement in introduction of the new generation of power devices on 200 mm Si and 150 mm SiC wafers in volume production
• Evaluation of new materials, methods and technologies (e.g. Electroplating) for the involved production areas
• Work closely together with Equipment and Maintenance Engineers to meet the production specifications and enhance process- and tool stability
• Responsibility for the development packages in cooperation with R&D and Product Engineering
• Definition, process qualification and tuning of the new and upgraded tools

Your background:

• University degree in Physics, Chemistry, Engineering etc. or related experience in semiconductors
• Solid background in wet etch processes with inorganic and organic chemistry
• More than 8 years of experience in semiconductor production environment in one or multiple areas: Wet Etch (SAT/SST/single spin etcher), Chemical Treatments, Wafer Thinning is a big plus
• Knowledge of the specific power semiconductor applications like thin wafers (< 150 µm) and/or IGBT processing is a clear advantage
• Experience with production-oriented semiconductor tools is beneficial
• Experience with failure analysis and process control
• Know-how in optimization of processes and tools to gain favorable device properties, yield and productivity
• Fluent English, knowledge of German is positive but not a requirement